Microfluidic module including an adhesiveless self-bonding rebondable polyimide
US8137641B2 · kind B2 · utility
1Cited by
28References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 16, 2011 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Feb 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of making a microfluidic module is disclosed that includes forming a fluid flow channel in a self-bonding rebondable polyimide film to provide a channel sheet, the self-bonding rebondable polyimide film having a first mask layer self-bonded thereto; removing the first mask layer from the channel sheet after forming the fluid flow channel; and self-bonding the surface of the channel sheet exposed by removal of the first mask layer to a cover sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.