Interconnection in multi-chip with interposers and bridges
US8138015B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2011 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Aug 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure formation method. The method may include: attaching a substrate, a first interposer, a second interposer, and a first bridge together such that the first interposer is on and electrically connected to the substrate, the second interposer is on and electrically connected to the substrate, the first interposer comprises at least a first transistor, and the second interposer comprises at least a second transistor. The method may alternatively include: disposing both a first and second interposer on a substrate, wherein the first and second interposer are each electrically connected to the substrate; and electrically connecting a first bridge to the first and second interposers, wherein (i) the first bridge is in direct physical contact with the substrate or (ii) a bottom surface of the first bridge is within the substrate and below a top surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.