Method of placing a semiconducting nanostructure and semiconductor device including the semiconducting nanostructure
US8138102B2 · kind B2 · utility
30Cited by
2References
12Claims
0Family size
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Key dates
| Filing date | Aug 21, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jul 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/191
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of placing a functionalized semiconducting nanostructure, includes functionalizing a semiconducting nanostructure including one of a nanowire and a nanocrystal, with an organic functionality including a functional group for bonding to a bonding surface, dispersing the functionalized semiconducting nanostructure in a solvent to form a dispersion, and depositing the dispersion onto the bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.