Semiconductor device with an electrode as an alignment mark, and method of manufacturing the same
US8138533B2 · kind B2 · utility
22Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2009 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Apr 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/024
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor substrate, a back side drawn electrode formed by embedding a first conductive material in a contact hole penetrating the semiconductor substrate through an insulating film formed to include a uniform thickness, used also as an alignment mark, and configured to draw out an electrode to the back side of the semiconductor substrate. The device further includes a pad provided on the back side of the semiconductor substrate, and connected to the back side drawn electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.