Yusuke Kohyama
79Patents
20h-index
46Co-inventors
88Inventor score
Filing activity: Jan 23, 1990 → Jun 25, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5959324A | Semiconductor device including an improved terminal structure | Electricity | 89 | Expired |
| US6222722A | Storage capacitor having undulated lower electrode for a semiconductor device | Electricity | 64 | Expired |
| US5142639A | Semiconductor memory device having a stacked capacitor cell structure | Electricity | 57 | Expired |
| US5555520A | Trench capacitor cells for a dram having single monocrystalline capacitor electrode | Electricity | 56 | Expired |
| US6051859A | DRAM having a cup-shaped storage node electrode recessed within an insulating layer | Electricity | 50 | Expired |
| US5281837A | Semiconductor memory device having cross-point DRAM cell structure | Electricity | 45 | Expired |
| US6403444B2 | Method for forming storage capacitor having undulated lower electrode for a semiconductor device | Electricity | 42 | Expired |
| US6153476A | Semiconductor device and method for manufacturing the same | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5336917A | Dynamic memory cell using hollow post shape channel thin-film transistor | Electricity | 28 | Expired |
| US5482869A | Gettering of unwanted metal impurity introduced into semiconductor substrate during trench formation | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5563085A | Method of manufacturing a semiconductor device | Electricity | 26 | Expired |
| US5616961A | Structure of contact between wiring layers in semiconductor integrated circuit device | Electricity | 25 | Expired |
| US5886411A | Semiconductor device using dual damascene technology and method for manufacturing the same | Electricity | 24 | Expired |
| US6020643A | Semiconductor memory device having contact holes of differing structure | Electricity | 24 | Expired |
| US5977583A | Semiconductor memory device including memory cells having a capacitor on bit line structure | Electricity | 23 | Expired |
| US8138533B2 | Semiconductor device with an electrode as an alignment mark, and method of manufacturing the same | Electricity | 22 | Active |
| US5266823A | Semiconductor device having film for controlling diffusion of impurity | Electricity | 22 | Expired |
| US6720606B1 | Dynamic semiconductor memory device having a trench capacitor | Electricity | 21 | Expired |
| US6329683A | Semiconductor memory device and manufacturing method thereof which make it possible to improve reliability of cell-capacitor and also to simplify the manufacturing processes | Electricity | 21 | Expired |
| US6198122A | Semiconductor memory and method of fabricating the same | Electricity | 20 | Expired |
| US6140673A | Semiconductor memory device and fabricating method | Electricity | 18 | Expired |
| US6774439B2 | Semiconductor device using fuse/anti-fuse system | Electricity | 16 | Expired |
| US6548844B1 | Capacitor having a structure capable of restraining deterioration of dielectric film, semiconductor device having the capacitor and method of manufacturing the same | Electricity | 16 | Expired |
| US6150690A | Structure of a capacitor section of a dynamic random-access memory | Electricity | 15 | Expired |
| US5545926A | Integrated mosfet device with low resistance peripheral diffusion region contacts and low PN-junction failure memory diffusion contacts | Electricity | 14 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.