Bond pad structure
US8138616B2 · kind B2 · utility
8Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jun 17, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond pad structure of an integrated circuit includes a conductive pad disposed on a first dielectric layer, a first conductive block formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug formed in the first dielectric layer, and an electrically floating first conductive plate situated under the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.