Method of forming a circuit board with improved via design
US8141245B2 · kind B2 · utility
1Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2008 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | May 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.