Conductive ball mounting method and surplus ball removing apparatus
US8141770B2 · kind B2 · utility
0Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2008 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jan 3, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surplus ball removing apparatus including a substrate stage, a substrate including a connection pad, a mask with opening to supply conductive ball onto the substrate, a surplus ball adhering head for removing surplus ball mounted on the substrate, adhering head moving system, an image processing portion, an adhesive material stage, and a ball recovering stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.