Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
US8142260B2 · kind B2 · utility
6Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2008 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jan 5, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02087
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.