Method of transferring a thin film onto a support
US8142593B2 · kind B2 · utility
4Cited by
185References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2006 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Aug 6, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of transferring a thin film onto a first support, includes supplying a structure comprising a film of which at least one part originates from a solid substrate of a first material and which is solidly connected to a second support having a thermal expansion coefficient that is different from that of the first material and close to that of the first support, forming an embrittled area inside the film that defines the thin film to be transferred, affixing the film that is solidly connected to the second support to the first support, and breaking the film at the embrittled area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.