Chloride analysis in acid copper plating baths
US8142640B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
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Key dates
| Filing date | Sep 6, 2007 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Feb 26, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The chloride concentration in an acid copper plating bath is determined from the chloride oxidation current measured under controlled hydrodynamic conditions at a noble metal electrode using specific voltammetric parameters. The measurement is made directly on the undiluted plating bath so that the chloride measurement is fast and no waste stream is generated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.