Adhesion promotion in printed circuit boards
US8142840B2 · kind B2 · utility
0Cited by
62References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2007 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Dec 14, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12694
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.