Eric Yakobson
25Patents
10h-index
23Co-inventors
75Inventor score
Filing activity: Oct 14, 1994 → Sep 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5733599A | Method for enhancing the solderability of a surface | Electricity | 33 | Expired |
| US5935640A | Method for enhancing the solderability of a surface | Electricity | 27 | Expired |
| US5468515A | Composition and method for selective plating | Chemistry; Metallurgy | 18 | Expired |
| US5518760A | Composition and method for selective plating | Chemistry; Metallurgy | 14 | Expired |
| US5536386A | Process for preparing a non-conductive substrate for electroplating | Electricity | 14 | Expired |
| US5632927A | Process for preparing a non-conductive substrate for electroplating | Electricity | 12 | Expired |
| US5759378A | Process for preparing a non-conductive substrate for electroplating | Electricity | 11 | Expired |
| US6294220A | Post-treatment for copper on printed circuit boards | Chemistry; Metallurgy | 10 | Expired |
| US7393781B2 | Capping of metal interconnects in integrated circuit electronic devices | Electricity | 10 | Active |
| US6440647B1 | Resist stripping process | Electricity | 10 | Expired |
| US7232478B2 | Adhesion promotion in printed circuit boards | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7332193B2 | Cobalt and nickel electroless plating in microelectronic devices | Electricity | 8 | Expired |
| US7268074B2 | Capping of metal interconnects in integrated circuit electronic devices | Electricity | 4 | Expired |
| US6436276B1 | Cathodic photoresist stripping process | Physics | 3 | Expired |
| US11035048B2 | Cobalt filling of interconnects | Electricity | 3 | Active |
| USRE45297E1 | Method for enhancing the solderability of a surface | General | 2 | Active |
| USRE45881E1 | Method for enhancing the solderability of a surface | General | 2 | Active |
| USRE45842E1 | Method for enhancing the solderability of a surface | General | 2 | Active |
| US7682432B2 | Adhesion promotion in printed circuit boards | Emerging Cross-Sectional Technologies | 1 | Active |
| US9040117B2 | Adhesion promotion in printed circuit boards | Emerging Cross-Sectional Technologies | 0 | Active |
| US11846018B2 | Method and wet chemical compositions for diffusion barrier formation | Electricity | 0 | Active |
| US12157944B2 | Method and wet chemical compositions for diffusion barrier formation | Electricity | 0 | Active |
| US12270121B2 | Composition and method for fabrication of nickel interconnects | Electricity | 0 | Active |
| US8142840B2 | Adhesion promotion in printed circuit boards | Emerging Cross-Sectional Technologies | 0 | Active |
| US11401618B2 | Cobalt filling of interconnects | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.