Textured chamber surface
US8142989B2 · kind B2 · utility
2Cited by
19References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2009 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Nov 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32477
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of fabricating a process chamber component having a textured surface with raised features. The method comprises providing a process chamber component having a surface, and forming a patterned resist layer on the process chamber component, the patterned resist layer having apertures that expose portions of the surface of the process chamber component therethrough. A textured surface having raised features is formed on the process chamber component by propelling grit particles with a gas that is pressurized to a pressure sufficiently high to cause the grit particles to erode and remove material from the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.