Methods and apparatuses to stiffen integrated circuit package
US8143110B2 · kind B2 · utility
10Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2009 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jul 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.