Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
US8143530B1 · kind B1 · utility
10Cited by
6References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 17, 2010 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Sep 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of each PTFE layer. A layer of liquid crystal polymer (LCP) is placed on both layers of etched copper foil. An external layer of etched copper foil is placed on the external surface of the LCP layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.