Monolithic microwave integrated circuit with diamond layer
US8143654B1 · kind B1 · utility
2Cited by
24References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 16, 2008 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Aug 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
Abstract
Embodiments of apparatuses, articles, methods, and systems for a monolithic microwave integrated circuit with a substrate having a diamond layer are generally described herein. Other embodiments may be described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.