Semiconductor device including redistribution line structure and method of fabricating the same
US8143693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2008 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Oct 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a semiconductor device. The semiconductor device includes a semiconductor chip having an active surface on which pads are disposed, a passivation layer pattern disposed to cover the active surface of the semiconductor chip and to expose the pads, a first insulation layer pattern disposed on the passivation layer pattern, a second insulation layer pattern disposed on only a portion of the first insulation layer pattern, and redistribution line patterns electrically connected to the pads and disposed so as to extend across the second insulation layer pattern and the first insulation layer pattern. A method of fabricating the same is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.