Chip-on-board package
US8143713B2 · kind B2 · utility
8Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2010 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Nov 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a chip-on-board package. The chip-on-board package may include a board, a grounding pad on a first surface of the board, the grounding pad including a body portion and at least one line portion, and at least two conductive pads on the first surface, the at least two conductive pads being arranged adjacent to the body portion. The at least one line portion may extend between the at least two conductive pads and the at least one line portion may have a narrower width than the at least two conductive pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.