YoungHoon Ro
6Patents
2h-index
13Co-inventors
44Inventor score
Filing activity: Apr 8, 2010 → Mar 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8143713B2 | Chip-on-board package | Electricity | 8 | Active |
| US8823185B2 | Semiconductor packages | Electricity | 5 | Active |
| US8587108B2 | Package for semiconductor device including guide rings and manufacturing method of the same | Electricity | 2 | Active |
| US9018041B2 | Package for semiconductor device including guide rings and manufacturing method of the same | Electricity | 0 | Active |
| US11373942B2 | Semiconductor devices | Electricity | 0 | Active |
| US9418914B2 | Package substrates, semiconductor packages having the package substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.