Vented die and package
US8143719B2 · kind B2 · utility
10Cited by
19References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2008 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jun 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.