Inventor · Singapore, SG

Hao Liu

11Patents

4h-index

18Co-inventors

53Inventor score

Filing activity: Sep 9, 2005 → Dec 17, 2018

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8426246B2	Vented die and package	Electricity	41	Active
US8143719B2	Vented die and package	Electricity	10	Active
US9379242B1	Method of fabricating fin field effect transistor	Electricity	9	Active
US9524967B1	Semiconductor device and method of forming the same	Electricity	4	Active
US8586465B2	Through silicon via dies and packages	Electricity	3	Active
US8741762B2	Through silicon via dies and packages	Electricity	2	Active
US8544755B2	Subscriber identity module (SIM) card	Electricity	2	Active
US8030761B2	Mold design and semiconductor package	Electricity	2	Active
US7816775B2	Multi-die IC package and manufacturing method	Electricity	1	Expired
US8399985B2	Mold design and semiconductor package	Electricity	0	Active
US10818556B2	Method for forming a semiconductor structure	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.