Wafer-level interconnect for high mechanical reliability applications

US8143722B2 · kind B2 · utility

Assignee

• Flipchip International LLC · US

Inventors

• Anthony P. Curtis · Phoenix, US
• Guy F. Burgess · Gilbert, US
• Michael E. Johnson · Chenoa, US
• Ted Tessier · Chandler, US
• Yuan Lu · Xiluo, TW

Key dates

• Filing date: Oct 4, 2007
• Grant date: Mar 27, 2012
• Expiry date: Sep 3, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An interconnect structure comprises a solder including nickel (Ni) and tin (Sn), with the nickel in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The (IMC) layer comprises a compound of copper and nickel.