Ted Tessier
2Patents
2h-index
4Co-inventors
33Inventor score
Filing activity: Oct 4, 2007 → Feb 16, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8143722B2 | Wafer-level interconnect for high mechanical reliability applications | Electricity | 8 | Active |
| US8754524B2 | Wafer-level interconnect for high mechanical reliability applications | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.