Diaphragm structure and MEMS device
US8146437B2 · kind B2 · utility
1Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2009 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Dec 3, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/005
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.