Patent · US Active

Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor

US8148198B2 · kind B2 · utility

0Cited by

5References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Georg Borghoff · Warstein, DE
Thomas Nuebel · Warstein, DE
Reinhold Spanke · Bestwig, DE
Martin Woelz · Soest, DE

Key dates

Filing date	Sep 28, 2006
Grant date	Apr 3, 2012
Priority date	—
Expiry date	Jun 3, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.