Substrate processing apparatus, coolant gas supply nozzle and semiconductor device manufacturing method
US8148271B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2006 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Oct 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing apparatus comprises a processing chamber for storing a boat supporting multiple substrates and for processing the multiple substrates, a heater unit installed around the processing chamber for heating the substrates, and a coolant gas supply nozzle including a pipe section extending perpendicular to a main surface of the substrate supported in the boat stored in the processing chamber, and a spray hole formed on the pipe section for spraying coolant gas to at least two of the multiple substrates, wherein the coolant gas supply nozzle is formed so that the cross sectional area of the pipe section in the area where the spray hole is formed is larger than the total opening area of the spray hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.