Polishing pad and manufacturing method thereof
US8148441B2 · kind B2 · utility
4Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | May 4, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2101/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method for manufacturing a polishing pad made from a polyurethane resin foam having very uniform, fine cells therein and a polishing pad obtained by that method provides a polishing pad having better polishing characteristics (especially, in planarization) while providing improved dressability while maintaining the planarization characteristics and polishing speed of a conventional polishing pad. The polyurethane resin foam is a cured product obtained by reacting an isocyanate-terminated prepolymer with an aromatic polyamine chain extender having a melting point of 70° C. or lower, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.