Forming compliant contact pads for semiconductor packages
US8148805B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2011 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Mar 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0367
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconductor die. In this way, improved connection between the semiconductor package and a socket is provided. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.