Apparatus for manufacturing printed circuit board
US8151446B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2008 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Jan 28, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53187
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.