Bonding apparatus and method
US8151852B2 · kind B2 · utility
3Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2009 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Sep 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.