Method of making printed wiring board and method of making printed circuit board unit
US8152953B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2009 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Feb 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.