Thermally cured underlayer for lithographic application
US8153346B2 · kind B2 · utility
1Cited by
9References
8Claims
0Family size
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Key dates
| Filing date | Feb 20, 2008 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Oct 25, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/094
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composition being a composition of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.