Profiled contact
US8154131B2 · kind B2 · utility
9Cited by
184References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2006 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Jan 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S2301/176
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.