Packaged electronic devices with face-up die having TSV connection to leads and die pad

US8154134B2 · kind B2 · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Thomas D. Bonifield · Dallas, US
• Gary P. Morrison · Garland, US
• Rajiv Dunne · Sachse, US
• Satyendra Singh Chauhan · Sugar Land, US
• Masood Murtuza · Sugar Land, US

Key dates

• Filing date: May 8, 2009
• Grant date: Apr 10, 2012
• Expiry date: May 8, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19104
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A packaged electronic device includes a leadframe including a die pad, a first, second, and third lead pin surrounding the die pad. An IC die is assembled in a face-up configuration on the lead frame. The IC die includes a substrate having an active top surface and a bottom surface, wherein the top surface includes integrated circuitry including an input pad, an output pad, a power supply pad, and a ground pad, and a plurality of through-substrate vias (TSVs) including an electrically conductive filler material and a dielectric liner. The TSVs couple the input pad to the first lead pin, the output pad to the second lead pin, the power supply pad to a third lead pin or a portion of the die pad. A fourth TSV couples pads coupled to the ground node to the die pad or a portion of the die pad for a split die pad.