Edge profiling for process chamber shields
US8156892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2008 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Feb 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Process chamber shields having specially profiled edges exhibit increased lifetime in PVD and CVD deposition chambers. Edge profiling reduces flaking and delamination of materials deposited onto the shields, thereby prolonging shield life, and, consequently, reducing costs associated with deposition. In one embodiment, a shield having an edge portion terminating in a rounded tip, where the tip has high curvature and a small thickness, is provided. In another aspect, a shield having a concave portion connecting with an edge portion, where an upper (inner) surface of the edge portion forms a tangent plane to the upper (inner) concave surface of the concave surface, is provided. In yet another aspect, a shield with a tapered edge portion is provided. Shields, having profiled edges in accordance with these aspects and in accordance with combinations of these aspects, can better support deposited films, particularly films containing compressively stressed materials, such as metal nitrides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.