Handling device and handling method for wafers
US8157307B2 · kind B2 · utility
2Cited by
9References
8Claims
0Family size
Inventor
Key dates
| Filing date | Feb 10, 2011 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Feb 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.