Device and process for applying and/or detaching a wafer to/from a carrier
US8157615B2 · kind B2 · utility
7Cited by
15References
15Claims
0Family size
Inventor
Key dates
| Filing date | Mar 12, 2009 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Sep 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68318
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a device for applying and/or detaching a wafer to/from a carrier with
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.