Continuously referencing signals over multiple layers in laminate packages
US8158461B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2009 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Jan 13, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mechanism for continuously referencing signals over multiple layers in laminate packages provides a continuous path for signals from one layer to another while using the ideal voltage reference for all areas of the package and still avoiding discontinuities in the voltage reference. A reference plane adjustment engine analyzes a package design and identifies an ideal top plane for all areas of the package, including areas under particular chip die(s) and areas that are not under a chip die. The reference plane adjustment engine then modifies the package design to reposition ground planes, source voltage planes, signal planes, and vias between layers to maintain a continuous voltage reference regardless of the top layer. The reference plane adjustment engine provides the resulting mixed voltage plane package design to a design analysis engine. A package fabrication system fabricates the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.