Francesco Preda
11Patents
2h-index
19Co-inventors
51Inventor score
Filing activity: Oct 25, 2002 → Oct 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7863724B2 | Circuit substrate having post-fed die side power supply connections | Emerging Cross-Sectional Technologies | 8 | Active |
| US7015574B2 | Electronic device carrier adapted for transmitting high frequency signals | Electricity | 6 | Expired |
| US8586476B2 | Fabrication method for circuit substrate having post-fed die side power supply connections | Emerging Cross-Sectional Technologies | 1 | Active |
| US10956649B2 | Semiconductor package metal shadowing checks | Physics | 0 | Active |
| US11388821B2 | Thin film capacitors for core and adjacent build up layers | Electricity | 0 | Active |
| US10423752B2 | Semiconductor package metal shadowing checks | Physics | 0 | Active |
| US8722536B2 | Fabrication method for circuit substrate having post-fed die side power supply connections | Emerging Cross-Sectional Technologies | 0 | Active |
| US12266598B2 | Dense via pitch interconnect to increase wiring density | Electricity | 0 | Active |
| US8716851B2 | Continuously referencing signals over multiple layers in laminate packages | Emerging Cross-Sectional Technologies | 0 | Active |
| US8158461B2 | Continuously referencing signals over multiple layers in laminate packages | Emerging Cross-Sectional Technologies | 0 | Active |
| US10660209B2 | Thin film capacitors for core and adjacent build up layers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.