MEMS microphone with cavity and method therefor
US8158492B2 · kind B2 · utility
13Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2009 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Mar 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D48/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device comprises a substrate, a micro electro-mechanical systems (MEMS) structure, and a dielectric film. The substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed on the first side of the substrate. The cavity is formed in the substrate directly opposite the MEMS structure. The cavity has an opening formed on the second side. The dielectric film is attached to the second side of the substrate and completely covering the opening. In one embodiment, the MEMS structure is a diaphragm for a microphone. Another embodiment includes a method for forming the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.