Flat leadless packages and stacked leadless package assemblies
US8159053B2 · kind B2 · utility
3Cited by
16References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2010 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Sep 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.