Vertical Circuits, Inc.
10Patents
6Active
10Granted
43Portfolio score
Filing activity: Aug 23, 1999 → Sep 28, 2010 · 6 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8178978B2 | Support mounted electrically interconnected die assembly | Electricity | 70 | Active |
| US7215018B2 | Stacked die BGA or LGA component assembly | Electricity | 63 | Expired |
| US7245021B2 | Micropede stacked die component assembly | Electricity | 38 | Expired |
| US7535109B2 | Die assembly having electrical interconnect | Electricity | 32 | Active |
| US7923349B2 | Wafer level surface passivation of stackable integrated circuit chips | Electricity | 31 | Active |
| US7843046B2 | Flat leadless packages and stacked leadless package assemblies | Electricity | 20 | Active |
| US7863159B2 | Semiconductor die separation method | Electricity | 18 | Active |
| US6486528B1 | Silicon segment programming apparatus and three terminal fuse configuration | Electricity | 14 | Expired |
| US8159053B2 | Flat leadless packages and stacked leadless package assemblies | Electricity | 3 | Active |
| US7705432B2 | Three dimensional six surface conformal die coating | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.