Method of producing a via in a reconstituted substrate
US8159076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2008 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Jul 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.