Distributed command and address bus architecture for a memory module having portions of bus lines separately disposed
US8161219B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2008 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Nov 14, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/409
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Distributed command and address bus architecture for memory modules and circuit boards is described. In one embodiment, a memory module includes a plurality of connector pins disposed on an edge of a circuit board, the plurality of connector pins comprising first pins coupled to a plurality of data bus lines, second pins coupled to a plurality of command and address bus lines, wherein the second pins are disposed in a first and a second region, wherein a portion of the first pins is disposed between the first and the second regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.