Printing head and manufacturing method of printing head
US8162444B2 · kind B2 · utility
2Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2009 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Feb 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There is provided a printing head which improves durability and increases reliability by reducing stress occurring in a bonding part between an electrode pad and an inner lead at cooling. The electrode pad and the inner lead are electrically connected in such a manner that in the bonding portions between the electrode pad and a stud bump, only a part of contacting portions between the electrode and the stud bump is bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.