Method of initiating molecular bonding
US8163570B2 · kind B2 · utility
9Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2009 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Aug 6, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of initiating molecular bonding, comprising bringing one face of a first wafer to face one face of a second wafer and initiating a point of contact between the two facing faces. The point of contact is initiated by application to one of the two wafers, for example, using a bearing element of a tool, of a mechanical pressure in the range from 0.1 MPa to 33.3 MPa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.