Enhanced pad design for solder attach devices
US8163643B1 · kind B1 · utility
1Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2010 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Oct 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3656
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed that has a die and a substrate having a die attachment area with a perimeter. A layer of solder connects the substrate and the die, the solder layer having at least one vent channel connected to the perimeter of the die attachment area, wherein the maximum distance from any point in the solder layer to the nearest free surface of the solder at a vent channel or at the perimeter of the die is less than the distance from the center of the die to the nearest edge of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.