MEMS device and method for manufacturing the same
US8166827B2 · kind B2 · utility
2Cited by
10References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2009 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Sep 17, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0133
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A MEMS device, including: a substrate having a first principal plane and a second principal plane opposite to the first principal plane; a through hole formed in the substrate; and a vibrating film formed over the first principal plane so as to cover the through hole. The first principal plane and the second principal plane are both a (110) crystal face; and the through hole has a substantially rhombic shape on the second principal plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.