Polishing pad
US8167690B2 · kind B2 · utility
12Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2007 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Mar 2, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad of excellent durability has a polishing layer is arranged on a base material layer, and the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 300 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.